Shear deformation behavior of a Sn–3Ag–0.5Cu single solder ball at intermediate strain rates
Author:
Funder
Ministry of Education, Science and Technology
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference19 articles.
1. High strain rate compression behavior for Sn–37Pb eutectic alloy, lead-free Sn–1Ag–0.5Cu and Sn–3Ag–0.5Cu alloys
2. Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test
3. The mechanics of the solder ball shear test and the effect of shear rate
4. Reliability of composite solder bumps produced by an in-situ process
5. In Situ Optical Creep Observation of Joint-Scale Tin–Silver–Copper Solder Shear Samples
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2. Increasing shear strength of Au–Sn bonded joint through nano-grained interfacial reaction products;Journal of Materials Science;2021-01-08
3. Thermally stable Ni/Au–Sn/Ni joint fabricated via transient liquid-phase bonding;Materials Science and Engineering: A;2020-01
4. Mechanical reliability of transient liquid phase bonding of Au–Sn solder with Ni(Cu) substrates;Journal of Materials Science: Materials in Electronics;2017-10-13
5. Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates;Journal of Alloys and Compounds;2017-01
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