On the crack-tip stress singularity of interfacial cracks in transversely isotropic piezoelectric bimaterials
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation
Reference23 articles.
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3. Closed form solutions for partially debonded circular inclusion in piezoelectric materials;Deng;Acta Mech.,1999
4. Interfacial debonding of an elliptical inhomogeneity in piezoelectric solids;Deng;ASME J. Appl. Mech.,1999
5. Electroelastic field concentrations in and around inhomogeneities in piezoelectric solids;Dunn;ASME J. Appl. Mech.,1994
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