Roles and mechanism analysis of chitosan as a green additive in low-tech node copper film chemical mechanical polishing-Reference-Cited by-同舟云学术

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Roles and mechanism analysis of chitosan as a green additive in low-tech node copper film chemical mechanical polishing

Published:2020-02 Issue: Volume:586 Page:124293
ISSN:0927-7757
Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
language:en
Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects

Author:

Zhou Jiakai,Niu Xinhuan,Wang Zhi,Cui Yaqi,Wang Jianchao,Yang Chenghui,Huo Zhaoqing,Wang Ru

Funder

Major National Science and Technology Special Projects

Natural Science Foundation of Tianjin China

Science and Technology Planning Project of Tangshan, China

Key Laboratory of Electronic Materials and Devices of Tianjin, China

Publisher

Elsevier BV

Subject

Colloid and Surface Chemistry

Reference55 articles.

1. Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurry;Nagar;Part I. Elucidating slurry chemistry,2010

2. Evaluating the large electromigration resistance of copper interconnects employing a newly developed accelerated life- test method;Nitta;Journal of The Electrochemcial Society,1993

3. A wafer-scale material removal rate profile model for copper chemical mechanical planarization;Lee;Int. J. Mach. Tools Manuf.,2011

4. Role of ammonium ions in colloidal silica slurries for Ru CMP;Wang;Ecs J. Solid State Sci. Technol.,2019

5. Fabrication of ruthenium thin film and characterization of its chemical mechanical polishing process;Chou;Mater. Chem. Phys.,2015

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4. Analysis, Identification, and Application of Distribution of Relaxation Times in CMP Slurry;Electrochimica Acta;2024-09

5. Green chemical mechanical polishing of copper with 2,5-dihydroxy-1,4-dithianeas as the inhibitor: Experimental and theoretical studies;Materials Letters;2024-07

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