The adsorption of cationic surfactants on photoresist surfaces and its effect on the pattern collapse in high aspect ratio patterning
Author:
Publisher
Elsevier BV
Subject
Colloid and Surface Chemistry
Reference42 articles.
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2. Pattern collapse in high aspect ratio DUV- and 193nm resists;Domke;Proc. SPIE,2000
3. The use of surfactant in the rinse to improve collapse behavior of chemically amplified photoresists;Junarsa;Proc. SPIE,2004
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1. Experimental studies of contact angle hysteresis phenomena on polymer surfaces — Toward the understanding and control of wettability for different applications;Advances in Colloid and Interface Science;2015-08
2. Collapse of patterns with various geometries during drying in photolithography: numerical study;Journal of Micro/Nanolithography, MEMS, and MOEMS;2012-08-06
3. Application of Aziridine Reactive Rinses in a Post-Development Process to Reduce Photoresist Pattern Collapse;PROC SPIE;2012
4. The effect of drying rate on pattern collapse performance in thin film lithography;SPIE Proceedings;2011-03-17
5. Methods to explore and prevent pattern collapse in thin film lithography;SPIE Proceedings;2010-03-11
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