Controllable synthesis of core-shell SiO2@CeO2 abrasives for chemical mechanical polishing on SiO2 film
Author:
Publisher
Elsevier BV
Subject
Colloid and Surface Chemistry
Reference39 articles.
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2. Preface—JSS Focus Issue on CMP for Sub-10 nm technologies;Philipossian;ECS J. Solid State Sci. Technol.,2019
3. Shallow trench isolation chemical mechanical planarization: a review;Srinivasan;ECS J. Solid State Sci. Technol.,2015
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5. Mechanism of polishing of SiO2 films by CeO2 particles;Hoshino;J. Non-Cryst. Solids,2001
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1. Evaluation of chemical mechanical polishing characteristics using mixed abrasive slurry: A study on polishing behavior and material removal mechanism;Applied Surface Science;2025-01
2. Systematic root cause analysis of ceria-induced defects during chemical mechanical planarization and cleaning;Journal of Manufacturing Processes;2024-10
3. Development of Ce/Cu co-doped dendritic mesoporous silica nanoparticles (DMSNs) as novel abrasive systems toward high-performance chemical mechanical polishing;Ceramics International;2024-09
4. Photocatalytic assisted chemical mechanical polishing for silicon carbide using developed ceria coated diamond core-shell abrasives;Tribology International;2024-09
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