Thermal conductivity enhancement of BN/silicone composites cured under electric field: Stacking of shape, thermal conductivity, and particle packing structure anisotropies-Reference-Cited by-同舟云学术

Thermal conductivity enhancement of BN/silicone composites cured under electric field: Stacking of shape, thermal conductivity, and particle packing structure anisotropies

Published:2012-02 Issue: Volume:529 Page:68-73
ISSN:0040-6031
Container-title:Thermochimica Acta
language:en
Short-container-title:Thermochimica Acta

Author:

Han Yuwang,Lv Sumin,Hao Chanxi,Ding Fei,Zhang Yi

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation

Reference28 articles.

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