Copper electroplating into deep microvias for the “SiP” application-Reference-Cited by-同舟云学术

Copper electroplating into deep microvias for the “SiP” application

Published:2011-05 Issue:5 Volume:88 Page:749-753
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Fang Cheng,Le Corre Alain,Yon Dominique

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Alain Rougier, Eef Bagerman, Solid State Technology 50 (2007).

2. T. Ritzdorf, C. Sharbono, Void-Free Cu Filling within High Aspect Ratio TSVs, June 2007.

3. Fred Roozeboom, Johan Klootwijk, Wouter Dekkers, Yann Lamy, Solid State Technology 51 (2008).

4. F. Murray, in: Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005, Santa Barbara, CA, USA, pp. 169–173.

5. Barrier and seed layer coverage in 3D structures with different aspect ratios using sputtering and ALD processes

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