Author:
Chen Xiao,Yan Peili,Tang Jiajie,Xu Gaowei,Luo Le
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. C.D. Nordquist, R.H. Olsson, T. Peterson, R. Shul, C. Ahlers, T.A. Plut, G.A. Patrizi, A new wafer-level packaging technology for MEMS with hermetic micro-environment, in: 61st Electronic Components and Technology Conference (ECTC), 2011, pp. 1604–1609.
2. Fabrication and Testing of a Wafer-Level Vacuum Package for MEMS Device
3. Charles Yang, Antai Xu, Ye Wang, Wafer level hermetic packaging of MOEMS devices, in: Electronic Manufacturing Technology Symposium. vol. 8, 2007, pp. 294–297.
4. Hong-da Chang, Chun-An Huang, S. Liu, S. Lin, M. Liao, S. Chiu, C. Chen, High hermetic performance of glass frit for MEMS package, in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010, pp. 1–3.
5. Jin-Sheng Chang, Jing-Yuan Lin, Shu-Ching Ho, Yao-Jung Lee, Wafer level glass frit bonding for MEMS hermetic packaging, in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010, pp. 1–4.
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献