Author:
Jim K.L.,Lee F.K.,Xin J.Z.,Leung C.W.,Chan H.L.W.,Chen Y.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
15 articles.
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1. Stability of flexible composite stamps with thermal nanoimprint;Applied Physics A;2018-07-20
2. Flat and highly flexible composite stamps for nanoimprint, their preparation and their limits;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2016-11
3. Reducing the risk of failure with flexible composite stamps;Microelectronic Engineering;2016-04
4. Flexible composite stamp for thermal nanoimprint lithography based on OrmoStamp;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2015-11
5. Nanoimprint technology for patterning functional materials and its applications;Microelectronic Engineering;2015-01