Author:
Xu Shaohui,Yao Pan,Zhang Jiandong,Huang Renrui
Funder
Huarun CSMC Technologies Corporation
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. Chemical Vapor Deposition of Tungsten;Zinn,1994
2. Effects of phase of underlying W film on chemical vapor deposited-W film growth and applications to contact-plug and bit line processes for memory devices;Kim;J. Vac. Sci. Technol. B,2007
3. Reducing the yield loss by filling contact area with gap-suppressed tungsten;Bakke;Equip. Electronic Products Manufact.,2016
4. Study of the step coverage and contact resistance by using two-step TiN barrier and evolve simulation;Sidhwa;IEEE T. Semi. M.,2005
5. Optical induce tungsten plug corrosion in CMP process;Chiu;IEEE Int. Symp. Phys. Fail. Anal ICs,2010
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