Variable-shaped e-beam lithography enabling process development for future copper damascene technology-Reference-Cited by-同舟云学术

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Variable-shaped e-beam lithography enabling process development for future copper damascene technology

Published:2011-08 Issue:8 Volume:88 Page:1978-1981
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Jaschinsky Philipp,Erben Jens-Wolfram,Choi Kang-Hoon,Schulze Knut,Gutsch Manuela,Blaschta Frieder,Freitag Martin,Schulz Stefan E.,Steidel Katja,Hohle Christoph,Gessner Thomas,Kuecher Peter

Funder

Free State of Saxony

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. High resolution variable-shaped beam direct write

2. Transitioning of direct e-beam write technology from research and development into production flow

3. Advanced Cu interconnects using air gaps

4. Evaluation of hybrid lithography and mix and match scenarios for electron beam direct write applications

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A shape-modification strategy of electron-beam direct writing considering circuit performance in LSI interconnects;SPIE Proceedings;2014-03-28

2. A dose modification strategy of electron beam direct writing considering TDDB reliability in LSI interconnects;Alternative Lithographic Technologies V;2013-03-26

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