Author:
Chiu C.C.,Huang C.J.,Yang S.Y.,Lee C.C.,Chiang K.N.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Reliability issues in Cu/low-k structures regarding the initiation of stress-voiding or crack failure
2. Cracking energy estimation of ultra low-k package using novel prediction approach combined with global–local modeling technique
3. Analysis of flip-chip packaging challenges on copper/low-k interconnects
4. C.J. Zhai, U. Ozkan, A. Dubey, Sidharth, R.C. II Blish, R.N. Master, in: Proceedings of the 56th IEEE Electronic Components and Technology Conference, 2006, pp. 709–717.
5. C. Odegard, T.C. Chiu, C. Hartfield, V. Sundararaman, in: Proceedings of the 55th IEEE Electronic Components and Technology Conference, 2005, pp. 1163–1171.
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