Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Area Array Packaging Handbook: Manufacturing and Assembly;Gilleo,2001
2. Manufacturing of solder bumps with Cu/Ta/Cu as under bump metallurgy
3. Single chip bumping and reliability for flip chip processes
4. Area Array Packaging Handbook: Manufacturing and Assembly;Gilleo,2001
5. G. Deltoro, N. Sharif, in: 24th IEEE/CPMT, 1999, pp. 185–188.
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献