Conformal electroless deposition of Cu seed layer on a 60-nm trench pattern modified with a self-assembled monolayer-Reference-Cited by-同舟云学术

Conformal electroless deposition of Cu seed layer on a 60-nm trench pattern modified with a self-assembled monolayer

Published:2009-03 Issue:3 Volume:86 Page:374-378
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Han Won-Kyu,Hwang Gil-Ho,Hong Seok-Jun,Kim Soo-Seok,Yoon Chong-Seung,Kwak Noh-Jung,Yeom Seung-Jin,Kim Jae-Hong,Kang Sung-Goon

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Copper electroless deposition technology for ultra-large-scale-integration (ULSI) metallization

2. An investigation of cluster formation in an ionized cluster beam deposition source

3. Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection

4. Formation of Catalytic Pd on ZnO Thin Films for Electroless Metal Deposition

5. Spectroscopic Ellipsometric Evaluation of Gold Nanoparticle Thin Films Fabricated Using Layer-by-Layer Self-Assembly

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