1. International Technology Roadmap for Semiconductors, 2007 edition, Process Integration, Devices, and Structures.
2. C.H. Lee, K.I. Choi, M.K. Cho, Y.H. Song, K.C. Park, K. Kim, in: Technical Digestion of IEDM, 2003, pp. 613–616.
3. Y. Shin, J. Choi, C. Kang, C. Lee, K.-T. Park, J.-S. Lee, J. Sel, V. Kim, B. Choi, J. Sim, D. Kim, H.-J. Cho, K. Kim, in: Technical Digestion of IEDM, 2005.
4. C.-H. Lee, J. Choi, C. Kang, Y. Shin, J.-S. Lee, J. Sel, J. Sim, S. Jeon, B.-I. Choe, D. Bae, K. Park, K. Kim, in: Technical Digest of VLSI, 2006.
5. Y. Park, J. Choi, C. Kang, C. Lee, Y. Shin, B. Choi, J. Kim, S. Jeon, J. Sel, J. Park, K. Choi, T. Yoo, J. Sim, K. Kim, in: Technical Digest of IEDM, 2006, pp. 29–32.