Heat transfer analysis of a high-brightness LED array on PCB under different placement configurations

Author:

Yung K.C.,Liem H.,Choy H.S.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference16 articles.

1. K.C. Yung, H.M. Liem, H.S. Choy, An arithmetic alignment method of rendering uniform illuminance and prolonging lifetime for LED array assemblies on PCB, Chinese Patent, Filing no. 201210382253.0 (2012).

2. Thermal analysis and optimization of multiple LED packaging based on a general analytical solution;Cheng;Int. J. Thermal Sci.,2010

3. Spacing of high-brightness LEDs on metal substrate PCB's for proper thermal performance;Petroski,2004

4. An optimum spacing problem for three-by-three heated elements mounted on a substrate;Chen;Heat Mass Transf.,2002

5. Uniform illumination rendering using an array of LEDs: a signal processing perspective;Yang;IEEE Trans. Signal Process.,2009

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