Numerical investigation on the heat transfer and flow in the mini-fin heat sink for CPU
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics
Reference28 articles.
1. Boiling of saturated FC-72 on square pin fin arrays;Guglielmini;International Journal of Thermal Sciences,2002
2. Analysis of microchannel heat sink for electronics cooling;Zhao;International Journal of Heat and Mass Transfer,2002
3. Effects of fin geometry on boiling heat transfer from silicon chips with micro-pin-fins immersed in FC-72;Wei;International Journal of Heat and Mass Transfer,2003
4. Enhanced boiling heat transfer from electronic components by use of surface microstructures;Honda;Experimental Thermal and Fluid Science,2004
5. An analytical solution of thermal resistance of cubic heat spreaders of electronic cooling;Feng;Applied Thermal Engineering,2004
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