Determining the mechanisms of dissolution and isothermal solidification kinetics during transient liquid phase bonding of commercially pure titanium using a pure copper interlayer-Reference-Cited by-同舟云学术

Determining the mechanisms of dissolution and isothermal solidification kinetics during transient liquid phase bonding of commercially pure titanium using a pure copper interlayer

Published:2020-09 Issue: Volume:24 Page:101363
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Tadgell Colin A.,Corbin Stephen F.

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference29 articles.

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5. Effect of brazing parameters on microstructure and mechanical properties of titanium joints;Elrefaey;J. Mater. Process. Technol.,2009

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