Creep behavior of sintered nano-silver at high temperature: Experimental and theoretical analysis

Author:

Li Bofeng,Wang Jundong,Yao Yao

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference42 articles.

1. Are sintered silver joints ready for use as interconnect material in microelectronic packaging?;Siow;J. Electron. Mater.,2014

2. Mechanical properties of nano-silver joints as die attach materials;Siow;J. Alloy. Compd.,2012

3. Quantitative characterization of porosity and determination of elastic modulus for sintered micro-silver joints;James;J. Mater. Process. Technol.,2015

4. Creep of sintered porous micron-silver: nanoindentation experiment and theoretical analysis;Gong;J. Mater. Sci.,2021

5. Gaussian filtering method of evaluating the elastic/elasto-plastic properties of sintered nanocomposites with quasi-continuous;Su;Mater. Sci. Eng. A,2023

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