1. Table of contents
2. J. Schuderer, V. Lindstroem, CIPS 2018; 10th International Conference on Integrated Power Electronics Systems, 2018.
3. Y. Kaji, K. Yamada, H. Harada, H., Rokubuichi, Y. Hanawa, J. Fujino, H. Takao, PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2021.
4. Silica/Epoxy Hybrid Encapsulation with High Heat-Resistance and Low Coefficient of Thermal Expansion
5. Melt Processable Novolac Cyanate Ester/Biphenyl Epoxy Copolymer Series with Ultrahigh Glass-Transition Temperature