Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes-Reference-Cited by-同舟云学术

Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes

Published:2012-11 Issue:11 Volume:52 Page:2690-2700
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Shu Ming-Hung,Hsu Bi-Min,Hu Min-Chuan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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3. Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling;Chen;Microelectron Reliab,2006

4. A hierarchical evaluation of the solder paste printing process;Francis;J Mater Process Technol,1997

5. The role of oxide layers in solder joints;Gorlich;J Alloy Compd,2010

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3. Effect of ultrasonic vibration on the interfacial IMC three-dimensional morphology and mechanical properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu halogen free solder joints;Journal of Materials Science: Materials in Electronics;2018-09-10

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