Author:
Navarro L.A.,Perpiñà X.,Vellvehi M.,Banu V.,Jordà X.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Packaging technology for electronics applications in harsh, high-temperature environments;Zheng;Proc IEEE Trans Industr Electron,2011
2. Power device packaging technologies for extreme environments;Johnson;Proc IEEE Trans Electron Packaging Manuf,2007
3. Masson A, Buttay C, Morel H, Raynaud C, Hascoet S, Gremillard L. High-temperature die-attaches for sic power devices. In: Proceedings of the 2011–14th European conference on power electronics and applications. EPE; 2011. p. 1–10.
4. Coppola L, Huff D, Wang F, Burgos R, Boroyevich D. Survey on high-temperature packaging materials for SiC-based power electronics modules. In: Proceedings of the IEEE power electronics specialist conference. PESC; 2007. p. 2234–40.
5. Die attach materials for high temperature applications: a review;Manikam;Proc IEEE,2011
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