Impact of high-power stress on dynamic ON-resistance of high-voltage GaN HEMTs

Author:

Jin Donghyun,del Alamo Jesús A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Cited by 23 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Suppression of Hot-Electron-Induced Dynamic RON Degradation in p-GaN Gate HEMT Using Active Passivation and Virtual Body;2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD);2024-06-02

2. Virtual-Body p-GaN Gate HEMT With Enhanced Ruggedness Against Hot-Electron-Induced Degradation;IEEE Electron Device Letters;2024-05

3. Enhanced robustness against hot-electron-induced degradation in active-passivation p-GaN gate HEMT;Applied Physics Letters;2024-03-04

4. Introduction to Part 1;Reliability and Physics‐of‐Healthy in Mechatronics;2022-12-09

5. Basic Reliability Tools for SHM Protocols;Reliability and Physics‐of‐Healthy in Mechatronics;2022-12-09

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