Failure mechanisms and qualification testing of passive components

Author:

Post H.A.,Letullier P.,Briolat T.,Humke R.,Schuhmann R.,Saarinen K.,Werner W.,Ousten Y.,Lekens G.,Dehbi A.,Wondrak W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Wondrak W, Dehbi A, Umbach G, Blessing A, Getto R, Pesl FP, et al. AEC reliability workshop; 2004.

2. Post HA, Lipnig M, Stuefler S, Wieser F. In: CARTS 2003 proceedings of 23nd capacitor and resistor technology symposium, 27–30 October, 2003, Stuttgart, Germany.

3. Dehbi A, Arquis S, Berrouche K, Covasso, S, Marth K, Post HA, et al. CARTS-Europe 2003, Stuttgart, 27–30 Oktober, 2003.

4. Ousten Y, Mejdi S, Fenech A, Deletage JY, Bechou L, Perichaud MG, et al. In: 6th international symposium on the physical and failure analysis of integrated circuits, (IPFA 97), Singapore, 21–25 July 1997.

5. Bechou L, Ousten Y, Danto Y. In: Proceedings of CART’S Europe, 12 October 2000, Brussel.

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