Measurements and simulations of transient characteristics of heat pipes-Reference-Cited by-同舟云学术

Measurements and simulations of transient characteristics of heat pipes

Published:2006-01 Issue:1 Volume:46 Page:109-115
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Legierski Jarosław,Wie¸cek Bogusław,de Mey Gilbert

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

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3. Garner SD. Heat pipes for electronics cooling applications. Electronics Cooling, September 1996.

4. Vaporation from capillaries in cooling electronics devices—evaporation coefficient evaluation;Wajman;Mixed Design of Integrated Circuits and Systems (MIXDES), Lodz/Poland, June 26–28,2003

5. Thyrum G. Critical aspects of modelling heat pipe assisted heat sinks. Thermacore Inc., http://www.thermacore.com.

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