Lead-free 0201 manufacturing, assembly and reliability test results-Reference-Cited by-同舟云学术

Lead-free 0201 manufacturing, assembly and reliability test results

Published:2006-02 Issue:2-4 Volume:46 Page:244-262
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ramkumar S. Manian,Ghaffarian Reza,Varanasi Arun

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Jarvina R, Greiner S, Warren R. 01005 SMT component assembly for wireless SIP modules. Skyworks Solutions Inc.

2. Designing a high yield 0201 assembly process for new product introduction;Baldwin;Circ Assem,2001

3. Wang M, Shangguan D, Geiger D, Nakajima K, Ho CC, Yi S. Board design and assembly process evaluation for 0201 components on PCBs. In: IPC SMEMA Council APEX conference proceedings, 2002. p. S30-1-1–8.

4. Huang T, Yu R. Getting factory ready for 0201 assembly. SMTA international conference, 2002.

5. Wang M, Shangguan D, Ong MT, Mattson F, Geiger D, Yi S, et al. Process characterization of PCB assembly using 0201 packages with lead free solder. Nepcon West-Fiberoptic Expo Conference, 2002, San Jose, CA.

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