Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Author:

Watanabe KazukiORCID,Kariya Yoshiharu,Yajima Naoyuki,Obinata Kizuku,Hiroshima Yoshiyuki,Kikuchi Shunichi,Matsui Akiko,Shimizu Hiroshi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Evaluation of reliability of metal films/multilayers;Zhang,2008

2. Effect of micro texture of electroplated copper thin films on their mechanical properties;Tamakawa;J. Soc. Mater. Sci., Jpn.,2007

3. Mechanical properties of electroplated copper thin films;Spolenak,1999

4. Evaluation on plastic deformation property of copper nano-film by nano-scale cantilever specimen;Sumigawa;Thin Solid Films,2010

5. The mechanical properties of electroplated Cu thin films measured by means of the bulge test technique;Xiang,2011

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