Author:
Liu Fan,Su Lei,Fan Mengying,Yin Jian,He Zhenzhi,Lu Xiangning
Funder
National Natural Science Foundation of China
Open Foundation of State Key Lab of Digital Manufacturing Equipment & Technology
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Thin profile flip chip package-on-package development;Hsieh,2016
2. Recent advances and new trends in nanotechnology and 3D integration for semiconductor industry;Lau,2012
3. An automated ultrasonic inspection approach for flip chip solder joint assessment;Yang;Microelectron. Reliab.,2012
4. Advanced fault localization techniques in microelectronics failure analysis;Chen,2015
5. Intelligent diagnosis of the solder bumps defects using fuzzy C-means algorithm with the weighted coefficients;Lu;SCIENCE CHINA Technol. Sci.,2015
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