1. Stress analysis during assembly and packaging;Schreier-Alt,2011
2. In-situ stress state measurements during chip-on-board assembly;Zou,1999
3. Internal stress state measurements of the large molded electronic control units;Gromala,2013
4. Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions;Schindler-Saefkow,2014
5. Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation;Schlottig,2013