Author:
Dowhań Łukasz,Wymysłowski Artur,Dudek Rainer
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. Łukasz Dowhań, Artur Wymysłowski, Rainer Dudek, Jürgen Auersperg. Parametric approach to numerical design for optimization of stacked packages. In: ESTC conference. Dresden, Germany; 2006.
2. Łukasz Dowhań, Artur Wymyłowski, Rainer Dudek, Jürgen Auersperg. Numerical approach to optimization of stacked packages. In: IMAPS conference, Kraków, Poland; 2006.
3. Smart and sequential approach to numerical prototyping in micro-electronic applications;Wymysłowski;JMEP,2005
4. van Driel WD, van de Peer J, Tzannetakis N, Wymysłowski A, Zhang Q. Advanced numerical prototyping methods in modern engineering applications. In: Proceedings of the fifth EuroSimE conference; 2004.
5. Jürgen Auersperg, Rainer Dudek, Bernd Michel. Combined fracture, delamination risk and fatigue evaluation of advanced microelectronics applications towards RSM/DOE concepts. In: Proceedings of the seventh EuroSimE conference; 2006.
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