Dynamic study of the thermal laser stimulation response on advanced technology structures-Reference-Cited by-同舟云学术

Dynamic study of the thermal laser stimulation response on advanced technology structures

Published:2008-10 Issue:10 Volume:48 Page:1689-1695
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Reverdy A.,de la Bardonnie M.,Poirier P.,Murray H.,Perdu P.,Boukkali A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

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3. Cole Jr EI, et al. Backside localization of open and shorted IC interconnections. In: International reliability physics symposium, 1998. p. 129–36.

4. Falk RA. Advanced LIVA/TIVA techniques. In: International symposium for testing and failure analysis, 2001. p. 59–65.

5. Palaniappan M, et al. New signal detection methods for thermal beam induced. In: International symposium for testing and failure analysis, 2001. p. 171–7.

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