The effect of downscaling the dimensions of solder interconnects on their creep properties

Author:

Wiese S.,Roellig M.,Mueller M.,Wolter K.-J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Effects of cooling rate on mechanical properties of near-eutectic tin–lead solder joints;Mei;J Electron Mater,1991

2. Subrahmanyan RA. Damage integral approach for low cycle and thermal fatigue. Dissertation, Cornell University, Ithaka, 1990.

3. Fatigue properties of microelectronics solder joints;Nir;Trans ASME,1991

4. Creep of thermally aged SnAgCu-solder joints;Wiese;Microelectron Reliab,2007

5. Experimental characterization of material properties of 63Sn37Pb flip chip solder joints;Wiese,1998

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