Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global–local modeling technique

Author:

Cinar Yusuf,Jang Jinwoo,Jang Gunhee,Kim Seonsik,Jang Jaeseok

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference26 articles.

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3. Che FX, Pang HLJ, Zhu WH, Sun Wei, Sun AYS, Wang CK, Tan HB. Development and assessment of global–local modeling technique used in advanced microelectronic packaging. In: International conference on thermal, mechanical and multi-physics simulation experiments in microelectronics and micro-systems, EuroSime; 2007. p. 1–7.

4. Zhu J, Quander S, Reinikainen T. Global/local modeling for PWB mechanical loading. In: Proceedings of 51th electronic components and technology conference, Orlando, 2001. p. 1164–9.

5. Vibration induced fatigue life estimation of ball grid array packaging;Wu;J Micromech Microeng,2009

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