Experimental and numerical approach on junction temperature of high-power LED-Reference-Cited by-同舟云学术

Experimental and numerical approach on junction temperature of high-power LED

Published:2014-05 Issue:5 Volume:54 Page:926-931
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Liu Dongjing,Yang Haiying,Yang Ping

Funder

National Natural Science Foundation of China

Jiangsu Province Science Foundation for Youths

Special Natural Science Foundation for Innovative Group of Jiangsu University and the Innovative Foundation for Doctoral Candidate of Jiangsu Province, China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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4. A review on the physical mechanisms that limit the reliability of GaN-based LEDs;Meneghini;IEEE Trans Electron Dev,2010

5. Reliability study on high power LED with chip on board;Dongjing;Int Conf Electron Pack Technol High Density Pack,2011

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