1. Low cost flip chip technologies for DCA, WLCSP, and PBGA assemblies;Lau,2000
2. Dou G, Whalley DC, Changqing L. The effect of co-planarity variation on anisotropic conductive adhesive assemblies. In: Proc 56th IEEE electronic components and technology conference. San Diego, CA, USA; 2006. p. 932–8.
3. Jang SY, Hong S-M, Park M-Y, Kwak D-O. FCOB (Flip Chip on Board) reliability study for mobile applications. In: Proc 54th IEEE electronic components and technology conference. Las Vegas, Nevada, USA; 2004. p. 62–7.
4. Jokinen E, Ristolainen E. Flip chip joining of thin chips on flexible PEN substrate. In: Proc 34th IMAPS international symposium on microelectronics, vols. 7–11. Baltimore, USA; 2001. p. 600–4.
5. Effect of wafer thinning methods towards fracture strength and topography of silicon die;Jiun;Microelectron Reliab,2006