Response surface models for efficient, modular estimation of solder joint reliability in area array packages-Reference-Cited by-同舟云学术

Response surface models for efficient, modular estimation of solder joint reliability in area array packages

Published:2005-03 Issue:3-4 Volume:45 Page:623-635
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zhang L.,Subbarayan G.,Hunter B.C.,Rose D.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference27 articles.

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3. An effective approach for three-dimensional finite element analysis of ball grid array typed packages;Cheng;ASME J. Electron. Packag.,1998

4. Decomposition techniques for the efficient analysis of area-array packages;Deshpande;ASME J. Electron. Packag.,2000

5. Deshpande AM. Partitioned analysis and approximation in optimization of mechanical systems: a focus on electronic packages. PhD thesis, University of Colorado, Boulder, CO, 1999

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