Author:
Tierno D.,Varela Pedreira O.,Wu C.,Jourdan N.,Kljucar L.,Tőkei Zs.,Croes K.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. The conductivity of thin metallic films according to the electron theory of metals;Fuchs;Math. Proc. Camb. Philos. Soc.,1938
2. The influence of a transverse magnetic field on the conductivity of thin metallic films;Sondheimer;Phys. Rev.,1950
3. Highly reliable Cu interconnect strategy for 10nm node logic technology and beyond;Kim,2014
4. CVD Mn-based self-formed barrier for advanced interconnect technology;Siew,2013
5. Alternative metals for advanced interconnects;Adelmann,2014
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