Micromechanical analysis of copper trace in printed circuit boards-Reference-Cited by-同舟云学术

Micromechanical analysis of copper trace in printed circuit boards

Published:2011-02 Issue:2 Volume:51 Page:416-424
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Hu Guojun,Goh Kim Yong,Judy Lim

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Hu GJ, Luan JE, Xavier B. Characterization of silicon die strength with application to die crack analysis. In: Proceedings of 33rd international electronics manufacturing conference; 2008. p. 1–7.

2. The effects of in-plane orthotropic properties in a multi-chip ball grid array assembly;Thomas;Microelectron Reliab,2002

3. Influence of electric artwork on thermomechanical properties and warpage of printed circuit boards;Grenestedt;J Appl Phys,2003

4. Prediction of microelectronic substrate warpage using homogeneized finite element models;Hutapea;Microelectron Eng,2006

5. Organic substrates for flip-chip design: a thermo-mechanical model that accounts for heterogeneity and anisotropy;Valdevit;Microelectron Reliab,2008

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