Author:
Yu Da,Al-Yafawi Abdullah,Nguyen Tung T.,Park Seungbae,Chung Soonwan
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components;Chen;Microelectron Reliab,2008
2. Vibration reliability test and finite element analysis for flip chip solder joints;Che;Microelectron Reliab,2009
3. Perkins A, Sitaraman SK. Vibration-induced solder joint fatigue failure of a ceramic column grid array (CCGA) package. In: Proc 54th electronic components and technology conference, Las Vegas; June 2004.
4. Vibration reliability characterization of PBGA assembly;Yang;Microelectron Reliab,2000
5. Pitarresi JM. Modeling of printed circuit cards subject to vibration. In: IEEE proceedings of the circuits and systems conference, New Orleans, LA; May 3–5, 1990. p. 2104–7.
Cited by
85 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献