Author:
Su Y.A.,Tan L.B.,Tee T.Y.,Tan V.B.C.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. The mechanics of solder alloy interconnects;Frear,1999
2. Darveaux R, Reichman C. Ductile-to-brittle transition strain rate. In: Electronics packaging technology conference, EPTC 2006; December 2006. p. 283–89.
3. Henshall Gregory, Healey Robert, Pandher Ranjit S, Sweatman Keith, Howell Keith, Coyle Richard, et al. Inemi Pb-free alloy alternatives project report: state of the industry. In: Surface mount technology association conference; 17 August 2008.
4. Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions;Suh;Mater Sci Eng A,2007
5. Mechanical properties for 95.5Sn–3.8Ag–0.7Cu lead-free solder alloy;Pang;IEEE Trans Compon Packag Technol,2005
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献