Author:
Mei J.,Haug R.,Lanier O.,Grözinger T.,Zimmermann A.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints;Hegde,2008
2. Reliability assessment of packaging solder joints under different thermal cycle loading rates;Wu;IEEE Trans. Device Mater. Reliab.,2015
3. Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints;Syed,2004
4. Reliability of power cycling for IGBT power semiconductor modules;Morozumi;IEEE Trans. Ind. Appl.,2003
5. Thermal–mechanical coupling analysis for coupled power- and thermal-cycling reliability of board-level electronic packages;Lai;IEEE Trans. Device Mater. Reliab.,2008
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16 articles.
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