Quantifying flux residues after soldering on technical copper using ultraviolet visible (UV–Vis) spectroscopy and multivariate analysis

Author:

Englert Tim,Stiedl Jan,Green Simon,Jacob Timo,Chassé Thomas,Rebner Karsten

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference51 articles.

1. Handbook for Critical Cleaning: Cleaning Agents and Systems;Kanegsberg,2011

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3. Optimal oxidation control for enhancement of copper lead frame-EMC adhesion in packaging process;Moon,1998

4. Effect of oxidation on mold compound-copper leadframe adhesion;Berriche,1999

5. Characterization of oxidized copper leadframes and copper Epoxy Molding Compound interface adhesion in plastic package;Kang,1998

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