Author:
Englert Tim,Stiedl Jan,Green Simon,Jacob Timo,Chassé Thomas,Rebner Karsten
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference51 articles.
1. Handbook for Critical Cleaning: Cleaning Agents and Systems;Kanegsberg,2011
2. The effect of the oxidation of cu-base leadframe on the interface adhesion between cu metal and epoxy molding compound;Cho;IEEE Trans. Components Packag. Manuf. Technol. Part B,1997
3. Optimal oxidation control for enhancement of copper lead frame-EMC adhesion in packaging process;Moon,1998
4. Effect of oxidation on mold compound-copper leadframe adhesion;Berriche,1999
5. Characterization of oxidized copper leadframes and copper Epoxy Molding Compound interface adhesion in plastic package;Kang,1998
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