An improved crack probability model for silicon oxide layers using three-parameter Weibull analysis-Reference-Cited by-同舟云学术

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An improved crack probability model for silicon oxide layers using three-parameter Weibull analysis

Published:2023-11 Issue: Volume:150 Page:115193
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Unterreitmeier M.,Nagler O.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. FAU Forschungen, Reihe B, Medizin, Naturwissenschaft, Technik, Band 33. Contact Related Failure Detection of Semiconductor Layer Stacks Using an Acoustic Emission Test Method;Unterreitmeier,2020

2. An acoustic emission sensor system for thin layer crack detection;Unterreitmeier;Microelectron. Reliab.,2018

3. Acoustic Emission Testing,2008

4. Determination of indenter crack probability on multilayer stacks using an acoustic emission test method;Unterreitmeier,2022

5. Mechanical Properties of Ceramics;Wachtman,2009

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