Author:
Fan X.J.,Lee S.W.R.,Han Q.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference47 articles.
1. Fan XJ. Moisture related reliability in electronic packaging, electronic component technology conference (ECTC) short course notes; 2008.
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3. Interfacial delamination mechanisms during reflow with moisture preconditioning;Fan;IEEE Trans Compon Pack Technol,2008
4. Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method;Lau;ASME J Electron Pack,2005
5. Driving mechanisms of delamination related reliability problems in exposed pad packages;van Driel;IEEE Trans Compon Pack Technol,2008
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