The reliability of wire bonding using Ag and Al-Reference-Cited by-同舟云学术

The reliability of wire bonding using Ag and Al

Published:2016-08 Issue: Volume:63 Page:336-341
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Schneider-Ramelow Martin,Ehrhardt Christian

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference32 articles.

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3. Process optimization and reliability study for Cu wire bonding advanced nodes;Qin,2014

4. Development and status of Cu ball/wedge bonding in 2012;Schneider-Ramelow;Journal of Electronic Materials (JEM),2013

5. Evaluation of Ag wire reliability on fine pitch wire bonding;Xi,2015

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