Investigation of low temperature SRAM and ROM failures to enable the replacement of cold test insertion by room temperature test-Reference-Cited by-同舟云学术

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Investigation of low temperature SRAM and ROM failures to enable the replacement of cold test insertion by room temperature test

Published:2007-09 Issue:9-11 Volume:47 Page:1362-1365
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Müller Stefan,Egger Peter

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference4 articles.

1. Egger P, Burmer C. SRAM failure analysis strategy. In: Proceeding from the 29th international symposium for testing and failure analysis ISTFA 2003. p. 177–83.

2. Grützner M. Advanced electrical analysis of embedded memory cells using atomic force probing. In: Proceedings of the 16th European symposium on reliability of electron devices, failure physics and analysis, ESREF 2005. p. 1509–13.

3. Case studies in atomic force probe analysis;Mulder;ISTFA,2006

4. Current image atomic force microscopy (CI-AFM) combined with atomic force probing for location and characterisation of advanced technology node;Tong;ISTFA,2004

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