Funder
National High-Tech R&D Program of China (863 Program)
National Natural Science Foundation of China
Postdoctoral Science Foundation of China
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. High power LED package with vertical structure;Lin;Microelectron. Reliab.,2012
2. Development and Prototyping of a HB-LED Array Module for Indoor Solid State Lighting;Lee,2006
3. Accelerated life test of high brightness light emitting diodes;Trevisanello;IEEE Trans. Device Mater. Reliab.,2008
4. Comparison of effect of epoxy and silicone adhesive on the lifetime of plastic LED package;Kim;Electron. Mater. Lett.,2013
5. Effects of moist environments on LED module reliability;Xiaobing;IEEE Trans. Device Mater. Reliab.,2010
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