Effect of NC pins ESD test on the reliability of integrated circuits with high density BGA package-Reference-Cited by-同舟云学术

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Effect of NC pins ESD test on the reliability of integrated circuits with high density BGA package

Published:2022-12 Issue: Volume:139 Page:114844
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lu Jian,Ma Yong,Zhang Kaihong,Yu Yongjian,Zhang Huibin

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. The drive to miniaturization;Peercy;Nature,2000

2. Effect of intermetallic compound thickness on mechanical fatigue properties of copper pillar micro-bumps;Zhu;Microelectron. Reliab.,2020

3. Reliability issues of thin film transistors subject to Electrostatic discharge stresses: an overview;Yan;Adv. Electron. Mater.,2021

4. ESD reliability study of a-si: H thin-film transistor technology: physical insights and technological implications;Sinha;IEEE T. Electron. Dev.,2019

5. Distributed ESD protection for high-speed integrated circuits;Kleveland;IEEE Electr. Device L.,2000

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