Machine learning for board-level drop response of BGA packaging structure

Author:

Mao Minghui,Wang Wenwu,Lu Changheng,Jia Fengrui,Long Xu

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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