Author:
Cui Haoyang,Zhou Mengfan,Yang Cheng,Li Jiawen,Wang Chong
Funder
National Natural Science Foundation of China
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. An industry-based survey of reliability in power electronic converters;Yang;IEEE Trans. Ind. Appl.,2011
2. A real-time adaptive IGBT thermal model based on an effective heat propagation path concept;Wang;IEEE J. Emerging Sel. Top. Power Electron.,2020
3. Monitoring initial solder layer degradation in a multichip IGBT module via combined TSEPs;Yang;IEEE Trans. Device Mater. Reliab.,2021
4. Review on junction temperature management of power semiconductor devices under power fluctuation condition;Zhou;Proc CSEE,2018
5. A lumped thermal model including thermal coupling and thermal boundary conditions for high-power IGBT modules;Bahman;IEEE Trans. Power Electron.,2018
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